Price: €450.00 EUR

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DCP11/15

Coating Specification:

• Thickness of diamond coating is about 70nm.
• Diamond coating is doped with nitrogen.
• Film resistivity: 0,5-1 Ohm*cm
• Tip curvature radius after coating is 50-70nm.
• Recommended for electrical modes (such as EFM, SCM, SKM, LAO Lithography, SRM)

Probe specification

• Standard chip size: 1.6x3.6x0.4 mm.
• High cemically stable reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
• Typical curvature radius of a tip: 10 nm.
• Tip height: 10 - 15 µm.
• Each chip has two RECTANGULAR springs.
• Compatible with the most commercial SPM devices.
• Silicon is doped by boron with the concentration about 5x10²⁰ cm^-3 to avoid electrostatic charges.
• Packaged in GelPak® boxes.

GelPak® is a registered trade mark of Vichem Corporation.

Specification for DCP11 series

Chip thickness 0.4mm Reflective side Au Spring number 2 Aspect ratio 3:1 Cone angle f <=22° Curvature radius of a tip typical 10nm

Available Cantilever series	Spring	Cantilever lenght, L±5µm	Cantilever width, W±3µm	Cantilever thickness, µm			Resonant frequency, kHz			Force constant, N/m
				min	typical	max	min	typical	max	min	typical	max
DCP11	A	100	35	1.7	2.0	2.3	190	255	325	5.5	11.5	22.5
	B	130	35	1.7	2.0	2.3	115	150	190	2.5	5.5	10