Price: €460.00 EUR

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NSG11/Au/15

High Resolution NONCONTACT "GOLDEN" Silicon Cantilevers NSG11 series with Au conductive coating

• Standard chip size: 1.6x3.6x0.4 mm.
• Compatible with the most commercial SPM devices.
• High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
• Tip side of the chip is coated by Au conductive coating.
• Thickness of Au film is 20-30nm.
• Typical curvature radius of a tip: 35 nm.
• Tip height: 10 - 15 µm.
• Each chip has two RECTANGULAR springs.
• Recommended for noncontact/semicontact modes.
• Packaged in GelPak® boxes.

GelPak® is a registered trade mark of Vichem Corporation.

Specification for probes of NSG11 series

Chip thickness 0.4mm Reflective side Au Spring number 2 Aspect ratio 3:1 Cone angle f <=22° Curvature radius of a tip typical 10nm

Cantilever series	Spring	Cantilever lenght, L±5µm	Cantilever width, W±3µm	Cantilever thickness, µm			Resonant frequency, kHz			Force constant, N/m
				min	typical	max	min	typical	max	min	typical	max
NSG11 NSG11S	A	100	35	1.7	2.0	2.3	190	255	325	5.5	11.5	22.5
	B	130	35	1.7	2.0	2.3	115	150	190	2.5	5.5	10

Cantilever series

Recommended measuring mode N - noncontact, semicontact C - contact	cantilever series	S - with calibrated SEM photo for each tip and guaranteed curvature radius 10nm or less.