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NSG01/TiN/15
| High Resolution NONCONTACT "GOLDEN" Silicon Cantilevers NSG01 series with TiN conductive coating |
- Standard chip size: 1.6x3.6x0.4 mm.
- High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
- Tip side of the chip is coated by TiN conductive coating.
- Thickness of TiN film is 20-30nm.
- Typical curvature radius of a tip: 35 nm.
- Tip height: 10 - 15 µm.
- Each chip has one RECTANGULAR spring.
- Recommended for noncontact/semicontact modes.
- Packaged in GelPak® boxes.
GelPak® is a registered trade mark of Vichem Corporation.
| Specification for probes of NSG01 series |
| Chip thickness |
0.4mm |
| Reflective side |
Au |
| Spring number |
1 |
| Aspect ratio |
3:1 |
| Cone angle j |
<=22° |
| Curvature radius of a tip |
typical 10nm | |
 |
|
Cantilever series |
Spring |
Cantilever lenght, L±5µm |
Cantilever width, W±3µm |
Cantilever thickness, µm |
Resonant frequency, kHz |
Force constant, N/m |
|
min |
typical |
max |
min |
typical |
max |
min |
typical |
max |
|
NSG01 |
A |
130 |
35 |
1.7 |
2.0 |
2.3 |
115 |
150 |
190 |
2.5 |
5.5 |
10 |
 |
Recommended measuring mode
N - noncontact, semicontact
C - contact |
cantilever series |
S - with calibrated SEM photo for each tip and guaranteed curvature radius 10nm or less. |
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