Price: €1,000.00 EUR

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CSG11/50

High Resolution CONTACT "GOLDEN" Silicon Cantilevers CSG11 series

• Standard chip size: 1.6x3.6x0.4 mm.
• High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
• Typical curvature radius of a tip: 10 nm.
• Tip height: 10 - 15 µm.
• Each chip has two RECTANGULAR springs.
• Recommended for contact mode.
• Can be supplied with conductive TiN, Pt, Au coatings.
• Calibrated SEM photo for each cantilever tip with guaranteed curvature radius 10nm or less.
• Packaged in GelPak® boxes.

GelPak® is a registered trade mark of Vichem Corporation.

Specification for probes of CSG11 series

Chip thickness 0.4mm Reflective side Au Spring number 2 Aspect ratio 3:1 Cone angle f <=22° Curvature radius of a tip typical 10nm

Cantilever series	Spring	Cantilever lenght, L±5µm	Cantilever width, W±3µm	Cantilever thickness, µm			Resonant frequency, kHz			Force constant, N/m
				min	typical	max	min	typical	max	min	typical	max
CSG11 CSG11S	A	250	35	0.7	1.0	1.3	14	20	28	0.03	0.1	0.2
	B	350	35	0.7	1.0	1.3	7	10	14	0.01	0.03	0.08

Highlights

• Calibrated SEM photo for each cantilever tip and guaranteed curvature radius 10nm or less at customer's requirement ( cantilever series with letter "S" in the series name).
• Compatible with the most commercial SPM devices.
• Chemically stable Au coating.
• Silicon is doped by boron with the concentration about 5x10²⁰ cm^-3 to avoid electrostatic charges.

Cantilever series

Recommended measuring mode N - noncontact, semicontact C - contact	cantilever series	S - with calibrated SEM photo for each tip and guaranteed curvature radius 10nm or less.