Price: €850.00 EUR

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NSG20/50

High Resonant Frequency NONCONTACT "GOLDEN" Silicon Cantilevers NSG20 series

• Standard chip size: 1.6x3.6x0.4 mm.
• High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
• Typical curvature radius of a tip: 10 nm.
• Tip height: 10 - 15 µm.
• Each chip has one TRIANGULAR spring.
• Recommended for semicontact modes and force lithography.
• Can be supplied with conductive TiN, W₂C, Pt, Au coatings.
• Calibrated SEM photo for each cantilever tip with guaranteed curvature radius 10nm or less.
• Packaged in GelPak® boxes.

GelPak® is a registered trade mark of Vichem Corporation.

Specification for NSG20 series

Chip thickness 0.4mm Reflective side Au Spring number 1 Aspect ratio 3:1 Cone angle j <=22° Curvature radius of a tip typical 10nm

Available Cantilever series	Cantilever lenght, L±5µm	Cantilever width, W±3µm	Cantilever thickness, µm			Resonant frequency, kHz			Force constant, N/m
			min	typical	max	min	typical	max	min	typical	max
NSG20, NSG20S	90	60	1.7	2.0	2.3	260	420	630	28	48	91

Highlights

• Calibrated SEM photo for each cantilever tip and guaranteed curvature radius 10nm or less at customer's requirement ( cantilever series with letter "S" in the series name).
• Compatible with the most commercial SPM devices.
• Chemically stable Au coating.
• Silicon is doped by boron with the concentration about 5x10²⁰ cm^-3 to avoid electrostatic charges.

Cantilever series

Recommended measuring mode N - noncontact, semicontact C - contact	cantilever series	S - with calibrated SEM photo for each tip and guaranteed curvature radius 10nm or less.