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Substrate
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· Standard chip size: 1.6x3.4x0.3 mm.
· Cross-section is trapezium-shape.
· High reflective chemically stable Au back side coating (reflectivity is 3 times better in comparison with uncoated probes).
· Compatible with the most of commercial AFM devices.
· The base silicon is highly doped to avoid electrostatic charges. |
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Cantilever
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· Rectangular shape.
· Cross-section is trapezium-shape.
· Backside width is given in probes specifications.
· Available for contact, semicontact and noncontact modes.
· Tip is set on the controlled distance 5-20ėm from the free cantilever end. |
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Tip
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· Total tip shape is tetrahedral, the last 500nm from tip apex is cylindrical.
· Tip height: 14 16 ėm.
· Typical curvature radius:
- of uncoated tips 6 nm, guaranteed 10nm;
- of coated tips 35nm.
· Tip offset: 5 - 20 ėm.
· Tip aspect ratio: 3:1 7:1.
· Front plane angle: 10°ą2°.
· Back plane angle: 30°ą2°.
· Side angle (half): 18°ą2°.
· Cone angle at the apex: 7° - 10°. |
Side View Sketch |
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Front View Sketch |
Golden Silicon Probes are available:
· with Au and Al reflective coating
· with PtIr, TiN, Au, diamond doped conductive coating
· with CoCr magnetic coating
· with no coatings (bare)
· tipless
Probes are packaged in GelPakŪ boxes. (GelPakŪ is a registered trade mark of Vichem
Corporation)
Guaranteed product yield is better than 90%.
Warranty: 1 year for uncoated probes and probes with reflective coating
6 months for probes with conductive coating
3 months for probes with magnetic coating
Copyright © 1998 - 2010, NT-MDT. All rights reserved.
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